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1. general description the GTL2018 is an octal translating transceiver designed for 3.3 v lvttl system interface with a gtl - /gtl/gtl+ bus. the direction pin (dir) allows the part to function as either a gtl-to-lvttl sampling receiver or as an lvttl-to-gtl interface. the GTL2018 lvttl inputs (only) are tolerant up to 5.5 v, allowing direct access to ttl or 5 v cmos inputs. 2. features n operates as an octal gtl - /gtl/gtl+ sampling receiver or as an lvttl to gtl - /gtl/gtl+ driver n 3.0 v to 3.6 v operation with 5 v tolerant lvttl input n gtl input and output 3.6 v tolerant n v ref adjustable from 0.5 v to 0.5v cc n partial power-down permitted n latch-up protection exceeds 500 ma per jesd78 n esd protection exceeds 2000 v hbm per jesd22-a114, 200 v mm per jesd22-a115, and 1000 v cdm per jesd22-cc101 n package offered: tssop24 3. quick reference data GTL2018 8-bit lvttl to gtl transceiver rev. 01 15 february 2007 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit c i input capacitance control inputs; v i = 3.0 v or 0 v - 2 2.5 pf c io input/output capacitance a port; v o = 3.0 v or 0 v - 4.6 6 pf b port; v o =v tt or 0 v - 3.4 4.3 pf gtl; v ref = 0.8 v; v tt = 1.2 v t plh low-to-high propagation delay an to bn; see figure 3 - 2.8 5 ns t phl high-to-low propagation delay an to bn; see figure 3 - 3.4 7 ns t plh low-to-high propagation delay bn to an; see figure 4 - 5.2 8 ns t phl high-to-low propagation delay bn to an; see figure 4 - 4.9 7 ns
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 2 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 4. ordering information 5. functional diagram table 2. ordering information t amb = - 40 c to +85 c. type number topside mark package name description version GTL2018pw GTL2018pw tssop24 plastic thin shrink small outline package; 24 leads; body width 4.4 mm sot355-1 fig 1. logic diagram of GTL2018 002aab603 GTL2018 a0 a1 a2 a3 b0 b1 b2 b3 vref dir a4 a5 b4 b5 a6 a7 b6 b7 & & & & & & & &
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 3 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin con?guration for tssop24 GTL2018pw gnd v cc b0 a0 b1 a1 b2 a2 b3 a3 vref gnd gnd a4 b4 a5 b5 a6 b6 a7 b7 v cc gnd dir 002aab604 1 2 3 4 5 6 7 8 9 10 11 12 14 13 16 15 18 17 20 19 22 21 24 23 table 3. pin description symbol pin description gnd 1, 7, 12, 19 ground (0 v) b0 2 data inputs/outputs (b side, gtl) b1 3 b2 4 b3 5 b4 8 b5 9 b6 10 b7 11 vref 6 gtl reference voltage dir 13 direction control input (lvttl) v cc 14, 24 positive supply voltage a7 15 data inputs/outputs (a side, lvttl) a6 16 a5 17 a4 18 a3 20 a2 21 a1 22 a0 23
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 4 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 7. functional description refer to figure 1 logic diag r am of GTL2018 . 7.1 function table 8. limiting values [1] the input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [2] current into any output in the low state. [3] current into any output in the high state. [4] the performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. the maximum junction temperature of this integrated circuit should not exceed 150 c. table 4. function table h = high voltage level; l = low voltage level. input input/output dir an (lvttl) bn (gtl) h input bn = an l an = bn input table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (groun d=0v). symbol parameter conditions min max unit v cc supply voltage - 0.5 4.6 v i ik input clamping current v i <0v - - 50 ma v i input voltage a port - 0.5 [1] 7.0 v b port - 0.5 [1] 4.6 v i ok output clamping current v o <0v - - 50 ma v o output voltage output in off or high state; a port - 0.5 [1] 7.0 v output in off or high state; b port - 0.5 [1] 4.6 v i ol low-level output current a port [2] -32ma b port [2] -80ma i oh high-level output current a port [3] - - 32 ma t stg storage temperature [4] - 60 +150 c
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 5 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 9. recommended operating conditions [1] unused inputs must be held high or low to prevent them from ?oating. [2] v tt maximum of 3.6 v with resistor sized to so i ol maximum is not exceeded. [3] a0 to a7 v i(max) is 3.6 v if con?gured as outputs (dir = low). table 6. recommended operating conditions [1] symbol parameter conditions min typ max unit v cc supply voltage 3.0 - 3.6 v v tt termination voltage [2] gtl - 0.85 0.9 0.95 v gtl 1.14 1.2 1.26 v gtl+ 1.35 1.5 1.65 v v ref reference voltage overall 0.5 2 3 v tt 0.5v cc v gtl - 0.5 0.6 0.63 v gtl 0.76 0.8 0.84 v gtl+ 0.87 1.0 1.10 v v i input voltage b port 0 v tt 3.6 v except b port [3] 0 3.3 5.5 v v ih high-level input voltage b port v ref + 0.050 - - v except b port 2 - - v v il low-level input voltage b port - - v ref - 0.050 v except b port - - 0.8 v i oh high-level output current a port - - - 16 ma i ol low-level output current b port - - 40 ma a port - - 16 ma t amb ambient temperature operating in free air - 40 - 85 c
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 6 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 10. static characteristics [1] all typical values are measured at v cc = 3.3 v and t amb =25 c. [2] the input and output voltage ratings my be exceeded if the input and output current ratings are observed. [3] this is the increase in supply current for each input that is at the speci?ed ttl voltage level rather than v cc or gnd. table 7. static characteristics recommended operating conditions; voltages are referenced to gnd (ground = 0 v); t amb = - 40 cto+85 c. symbol parameter conditions min typ [1] max unit v oh high-level output voltage a port; v cc = 3.0 v to 3.6 v; i oh = - 100 m a [2] v cc - 0.2 - - v a port; v cc = 3.0 v; i oh = - 16 ma [2] 2.0 - - v v ol low-level output voltage b port; v cc = 3.0 v; i ol =40ma [2] - 0.23 0.4 v a port; v cc = 3.0 v; i ol =8ma [2] - 0.28 0.4 v a port; v cc = 3.0 v; i ol =12ma [2] - 0.40 0.55 v a port; v cc = 3.0 v; i ol =16ma [2] - 0.55 0.8 v i i input current control inputs; v cc = 3.6 v; v i =v cc or gnd -- 1 m a b port; v cc = 3.6 v; v i =v tt or gnd - - 1 m a a port; v cc = 0 v or 3.6 v; v i = 5.5 v - - 10 m a a port; v cc = 3.6 v; v i =v cc -- 1 m a a port; v cc = 3.6 v; v i =0v - - - 5 m a i oz off-state output current a port; v cc =0v; v i or v o = 0 v to 3.6 v - - 100 m a i cc supply current a port; v cc = 3.6 v; v i =v cc or gnd; i o =0ma - 8 12 ma b port; v cc = 3.6 v; v i =v tt or gnd; i o =0ma - 8 12 ma d i cc [3] additional supply current per input; a port or control inputs; v cc = 3.6 v; v i =v cc - 0.6 v - - 500 m a c i input capacitance control inputs; v i = 3.0 v or 0 v - 2 2.5 pf c io input/output capacitance a port; v o = 3.0 v or 0 v - 4.6 6 pf b port; v o =v tt or 0 v - 3.4 4.3 pf
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 7 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 11. dynamic characteristics [1] all typical values are at v cc = 3.3 v and t amb =25 c. 11.1 waveforms v m = 1.5 v at v cc 3 3.0 v; v m = 0.5v cc at v cc 2.7 v for a ports and control pins; v m =v ref for b ports. table 8. dynamic characteristics v cc = 3.3 v 0.3 v. symbol parameter conditions min typ [1] max unit gtl - ; v ref = 0.6 v; v tt = 0.9 v t plh low-to-high propagation delay an to bn; see figure 3 - 2.8 5 ns t phl high-to-low propagation delay an to bn; see figure 3 - 3.3 7 ns t plh low-to-high propagation delay bn to an; see figure 4 - 5.3 8 ns t phl high-to-low propagation delay bn to an; see figure 4 - 5.2 8 ns gtl; v ref = 0.8 v; v tt = 1.2 v t plh low-to-high propagation delay an to bn; see figure 3 - 2.8 5 ns t phl high-to-low propagation delay an to bn; see figure 3 - 3.4 7 ns t plh low-to-high propagation delay bn to an; see figure 4 - 5.2 8 ns t phl high-to-low propagation delay bn to an; see figure 4 - 4.9 7 ns gtl+; v ref = 1.0 v; v tt = 1.5 v t plh low-to-high propagation delay an to bn; see figure 3 - 2.8 5 ns t phl high-to-low propagation delay an to bn; see figure 3 - 3.4 7 ns t plh low-to-high propagation delay bn to an; see figure 4 - 5.1 8 ns t phl high-to-low propagation delay bn to an; see figure 4 - 4.7 7 ns v m = 1.5 v for a port and v ref for b port a port to b port a. pulse duration b. propagation delay times fig 3. voltage waveforms 002aab140 3.0 v 0 v t p v m v m 002aab141 3.0 v 0 v v oh v ol t plh t phl v ref v ref 1.5 v 1.5 v input output
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 8 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 12. test information prr 10 mhz; z o =50 w ; t r 2.5 ns; t f 2.5 ns fig 4. propagation delay, bn to an 002aab142 v tt 1 / 3 v tt v oh v ol t plh t phl 1.5 v 1.5 v v ref v ref input output fig 5. load circuitry for switching times r l = load resistor. c l = load capacitance; includes jib and probe capacitance. r t = termination resistance; should be equal to z o of pulse generators. fig 6. load circuit for b outputs pulse generator v o c l 50 pf 002aab006 r l 500 w r t v i v cc dut pulse generator dut v o c l 30 pf 25 w 002aab143 r t v i v cc v tt
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 9 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 13. package outline fig 7. package outline sot355-1 (tssop24) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 0.4 0.3 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot355-1 mo-153 99-12-27 03-02-19 0.25 0.5 0.2 w m b p z e 112 24 13 pin 1 index q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a d y 0 2.5 5 mm scale tssop24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm sot355-1 a max. 1.1
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 10 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 14. soldering this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 surface mount re?ow soldering description . 14.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electrical circuits. the soldered joint provides both the mechanical and the electrical connection. there is no single soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for ?ne pitch smds. re?ow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 wave and re?ow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. the re?ow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature pro?le. leaded packages, packages with solder balls, and leadless packages are all re?ow solderable. key characteristics in both wave and re?ow soldering are: ? board speci?cations, including the board ?nish, solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivity level of the packages ? package placement ? inspection and repair ? lead-free soldering versus pbsn soldering 14.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhesive and ?ux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath speci?cations, including temperature and impurities
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 11 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 14.4 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; note that a lead-free re?ow process usually leads to higher minimum peak temperatures (see figure 8 ) than a pbsn process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? re?ow temperature pro?le; this pro?le includes preheat, re?ow (in which the board is heated to the peak temperature) and cooling down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in accordance with t ab le 9 and 10 moisture sensitivity precautions, as indicated on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during re?ow soldering, see figure 8 . table 9. snpb eutectic process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 3 350 < 2.5 235 220 3 2.5 220 220 table 10. lead-free process (from j-std-020c) package thickness (mm) package re?ow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 12 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver for further information on temperature pro?les, refer to application note an10365 surface mount re?ow soldering description . 15. abbreviations 16. revision history msl: moisture sensitivity level fig 8. temperature pro?les for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 11. abbreviations acronym description cdm charged device model cmos complementary metal oxide semiconductor dut device under test esd electrostatic discharge gtl gunning transceiver logic hbm human body model lvttl low voltage transistor-transistor logic mm machine model prr pulse repetition rate ttl transistor-transistor logic table 12. revision history document id release date data sheet status change notice supersedes GTL2018_1 20070215 product data sheet - -
GTL2018_1 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 01 15 february 2007 13 of 14 nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver 17. legal information 17.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 17.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 17.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 17.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 18. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors GTL2018 8-bit lvttl to gtl transceiver ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 15 february 2007 document identifier: GTL2018_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 19. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 quick reference data . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 4 7.1 function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 9 recommended operating conditions. . . . . . . . 5 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 6 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11.1 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 14.1 introduction to soldering . . . . . . . . . . . . . . . . . 10 14.2 wave and re?ow soldering . . . . . . . . . . . . . . . 10 14.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 10 14.4 re?ow soldering . . . . . . . . . . . . . . . . . . . . . . . 11 15 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 16 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 17 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 17.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 17.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 17.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 17.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 18 contact information. . . . . . . . . . . . . . . . . . . . . 13 19 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

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